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Series ADP200 with Sample Load Lock

Industrial LEED and AES Depth Profiler

Nano-scale measurements of elemental composition on thin films and alloys

Analytical system based on LEED and Auger Electron Spectroscopy and Argon ion sputtering for composition and thickness depth profiling of thin films and alloys

Features

Sub-nanometer precision for atomic structures, composition and thickness
Analysis of wide range of samples
Semi-automatic operation

Specifications

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Download Brochure

Download the ADP200 Series Brochure (PDF)

Specifications

Series ADP200 Industrial LEED and AES Depth Profiler

AES Analyzer

Analyzer Type: retarding field analyzer with coaxial electron gun
Energy Resolution: less than 0.5 %
Working Distance: 10 mm
Detector: channel Electron Multiplier with 1x10⁷ - 10⁸ gain range
Mounting Flange: CF4.5" O.D. standard flange (DN63CF)

Electron Gun

Type: double electrostatic lenses with adjustable focal length and beam diameter
Beam Voltage: 0 to 3 kV
Beam Current: up to 50 FA
Beam Diameter: up to 800 Fm
Filament: tungsten hairpin wire
Magnetic Shielding: Mu-metal tube with front cover

Ion Sputtering Gun

Ion Source: Electron impact ionization in magnetic field
Ionization Cathode: Tungsten - rhenium filament
directly mounted on the 70 mm O.D. CF flange
Beam Current: up to 10 uA
Beam Energy: 0 - 3.0 keV
Beam Size: from 5 to 25 mm in diameter
Beam Uniformity: Less than 5%
Gas Input: Direct gas input to ion source via leak valve
Mounting: CF2.75" (70mm) O.D. flange

Sample Handling

Sample size: from 10 - 20 mm size
Sample loading: single sample loading
Sample transfer: linear magnetic sample transfer

Vacuum System

Chamber: UHV compatible 100 mm welded chamber (304 L stainless steel)
Vacuum Pumps: 60 l/sec ion pump and 50 l/sec turbomolecur pump backed by fore pump
Gauging: wide range gauges
Vacuum Compatibility: all UHV materials
Bakeability: under vacuum 250 °C max.