ocivm.com > LEED / AES Spectrometers > FemtoLEED DLD L1000
Collaboration with RoentDek in Germany. Notes:
Different electronics & software: LPS075-D (electron gun & grids); DLA-TR8 (controller for delay line detector & computer interface PCI card); DLD-LIM32 (delay line detector acquisition software & LEED analysis software for Windows 7/10); Cobold (for analyzing data from anode – hit times, location calculations etc. – to produce image).
In addition to the LPS075-D & MCPS02 controllers, a DLA-TR8 controller from RoentDek is needed for operation of the hexDLD-anode.
The FemtoLEED DLD L1000 with integral shutter enables measurements of ultra-sensitive and insulating films. Instead of a fluorescent screen, it uses a delay line detector which allows for fully digital operation. The hex-anode provides minimized blind area due to the redundant detection opportunities of the added third delay line layer.
The FemtoLEED DLD L1000 is specifically useful for investigations on ultra-sensitive and insulating films. The fully digital system negates the need for an external CCD camera for live image capture.
For seamless integration, 3D step files are available for all models.
For detailed specifications, download FemtoLEED DLD L1000 Configuration and Specifications (PDF).
Optics | |
---|---|
Detector | Delay Line Detector with dynamic range 32 bit per channel, 75 microns spatial resolution and active area diameter 75mm |
Acceptance angle | 77 °C angle of acceptance from sample |
Retarding Field Analyser | Concentric assembly of hemispherical grids |
Working distance | 15mm from sample |
Grid material | Gold coated tungsten wire mesh (100 mesh, 81% transparency) |
Energy Resolution | 0.2% |
Monitoring | 10" standard viewport |
Linear motion | External nipple with bellow up to 150mm retraction |
Integral Shutter | Manual shutter driven by a rotary feedthrough |
Magnetic shielding | Mu-metal cylinder with front cover for maximum attenuation |
Assembly | Extreme-high-vacuum compatibility with stainless steel, high alumina and Au-plated copper alloy materials |
Mounting | CF10" (DN200CF) double sided conflat flange with sample distance 145mm – 580mm |
Bakeability | Under vacuum, 250 °C maximum |
Integral Miniature Electron Gun | |
Beam energy system | LEED – 2 µA at 100 eV and 0.5mm beam size |
Beam size | from 1mm to 250 µm - adjusted by Wehnelt potential, limited by exchangeable aperture down to 50 µm |
Electron source | Tungsten-2% thoriated filament standard, single crystal LaB 6 filament optional |
Energy spread | 0.45 eV (thoriated - tungsten filament) |
Overall size | 10mm lens diameter and 80mm length |
Microchannel Plates | |
Working area | 75mm |
L/D ratio | 80:1 |
Channel diameter | 13 microns |
Center to center spacing | 32 microns |
Plate thickness | 1.0mm |
Bias angle | 20 ° |
Electron gain | 10 7 , operating in pulsed mode |
The FemtoLEED DLD L1000 optics is controlled using a LPS075-D power supply with a MCPS02 controller used to operate the microchannel plates. In addition to the LPS075-D and MCPS02 controllers, the DLA-TR8 controller from Roentdek is needed for operation of the hexDLD-anode. Integral shutter (Model ISH) and LaB6 filament (Model LaB6) are further options.
For more information, download FemtoLEED DLD L1000 Configuration and Specifications (PDF).