ocivm.com > Home

Sharp diffraction patterns - Low Energy Electron Diffraction (LEED). Identification of elements on surface - Auger Electron Spectroscopy (AES). Ion cleaning of surfaces - Ion Sputtering. UHV Systems - Ultra High Vacuum Systems. OCI Vacuum Microengineering Inc. UHV System with worldwide map in the background. Header image.

The progress of our modern world depends on technological advances in electronics, energy, computing and medical technology; development of nanomaterials will offer new solutions for these forthcoming advances. However, synthesis of new nanomaterials depends on understanding of physics and chemistry of atomic interactions, process knowledge and capabilities of characterization tools. Our team at OCI Vacuum Microengineering, Inc. is dedicated to helping in all these areas of research and development within our fields of expertise.

LEED and Auger Spectroscopy UHV Systems Since 1990

OCI Vacuum Microengineering Inc. is a manufacturer of basic surface analytical tools for thin films based on Auger electron spectroscopy (AES), low energy electron diffraction (LEED), mass spectrometry, ion and electron sources. The main application of low energy electron diffraction (LEED) and Auger electron spectroscopy (AES) is to measure two dimensional surface crystallography and ultra-thin elemental composition.

Low energy electrons have unique capability to penetrate material in the depth of nanometers and together with comparable wavelength to crystal lattice spacing makes this instrument the excellent tool for characterization of two dimensional structures, domains and ultra-thin films. Those materials have wide range of potential applications in epitaxy, magnetic thin-films (spinotronics and superconductors), molecular electronics, low-e thin film coating, next generation photovoltaic, etc. The LEED and AES spectrometer is complementary analytical tool for molecular beam epitaxy (MBE), scanning tunneling microscopy (STM), X-ray photoemission spectroscopy (XPS) and for almost any vacuum thin film deposition system.